Vice President of Worldwide Field Application Engineering

The Company is seeking a Vice President of Worldwide Field Application Engineering to lead and scale its global field engineering organization. The role oversees regional application engineering leaders and the technical customer journey, from initial evaluation through integration, deployment, and ongoing adoption. Responsibilities include guiding the integration of semiconductor IP and related design tools into customer workflows, leading technical evaluations and customer reviews, and building trusted relationships with senior customer stakeholders. The Vice President will also partner with sales teams on strategic accounts and collaborate with research, product, and program leaders to turn customer needs into improvements and growth opportunities. Candidates should have at least 15 years of semiconductor industry experience, including substantial experience in field, applications, customer, or related technical engineering roles. They must have a record of leading and scaling global organizations across multiple management levels and geographies, along with hands-on knowledge of semiconductor design and physical design flows, including synthesis, place and route, static timing analysis, and SoC or ASIC design. Experience with semiconductor IP or electronic design automation solutions and their integration into customer environments is required. Strong executive-level customer relationship skills, business acumen, communication, presentation, negotiation, and cross-functional collaboration are essential.